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3 edition of 2002 7th International Symposium on Plasma- and Process-Induced Damage found in the catalog.

2002 7th International Symposium on Plasma- and Process-Induced Damage

International Symposium on Plasma Process-Induced Damage (7th 2002 Maui, Hawaii)

2002 7th International Symposium on Plasma- and Process-Induced Damage

June 5-7, 2002, Maui, Hawaii, USA

by International Symposium on Plasma Process-Induced Damage (7th 2002 Maui, Hawaii)

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  • 17 Currently reading

Published by AVS in Santa Clara, California .
Written in English

    Subjects:
  • Semiconductor wafers -- Congresses.,
  • Semiconductors -- Effect of radiation on -- Congresses.,
  • Plasma radiation -- Congresses.

  • Edition Notes

    Other titlesP²ID, Plasma- and process-induced damage, Plasma process induced-damage
    StatementTerence Hook, Koji Eriguchi, and Calvin T. Gabriel, editors ; technical co-sponsors, AVS, IEEE/Electron Devices Society, Japanese Society of Applied Physics.
    GenreCongresses.
    ContributionsHook, Terence., Eriguchi, Koji., Gabriel, Calvin T., American Vacuum Society., IEEE Electron Devices Society., Ōyō Butsuri Gakkai.
    Classifications
    LC ClassificationsTK7871.85 .I5834 2002
    The Physical Object
    Pagination[6], i, 177 p. :
    Number of Pages177
    ID Numbers
    Open LibraryOL3702215M
    ISBN 100965157776, 0965157784
    LC Control Number2003268804
    OCLC/WorldCa50819437

    Invited Journal Papers. 1. Invited Paper, M.M.R. Howlader, P.R. Selvaganapathy, M.J. Deen and T. Suga, “Nanobonding Technology Toward Electronic,Fluidic and Photonic Systems Integration,” IEEE Journal of Selected Topics in Quantum Electronics, Available on-line, Vol. 17(3), pp. (May/June ) 2. Invited Review Paper, Farseem M. Mohammedy and M. Jamal Deen, . The automated fiber placement process (AFP) enables the manufacturing of large and geometrical complex fiber composite structures with high quality at low cycle times. Although the AFP process is highly accurate and reproducible, manufacturing induced imperfections in the produced composite structure occur. This review summarizes and classifies typical AFP Cited by: 1.

    International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings International Symposium on Technology and Society, Proceedings Proceedings of the ACM SIGSOFT International Symposium on Software Testing and Analysis Proceedings of the ACM SIGPLAN Workshop on Rule-Based Programming. 5TH INTERNATIONAL SYMPOSIUM ON PLASMA PROCESS-INDUCED DAMAGE, 5th International Symposium on Plasma Process-Induced Damage (P2ID) DOI Author Url. Sii HK, Zhang JF, Degraeve R, Groeseneken G.

    Sergey Zaytsev, Walter Blondel, Marine Amouroux, Grégoire Khairallah, Alexey Bashkatov, Valery Tuchin, Elina Genina Proc. SPIE. , Saratov Fall Meeting Optical and Nano-Technologies for Biology and Medicine. in Proceedings of IEEE International Electron Devices Meeting - IEDM, International Symposium on Technology Evolution for Silicon Nano-Electronics - ISTESNE, Washington, DC USA, Tokyo Japan, Thijs S., Tremouilles D., Linten D., Mahadeva Iyer R., Griffoni A., Groeseneken G., " Advanced ESD power clamp design for SOI FinFET CMOS technology.".


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2002 7th International Symposium on Plasma- and Process-Induced Damage by International Symposium on Plasma Process-Induced Damage (7th 2002 Maui, Hawaii) Download PDF EPUB FB2

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